TANTEC处理器RotoVAC

TANTEC处理器RotoVAC

Tantec RotoVAC 真空等离子处理机设计用于小型注塑成型塑料零件的等离子处理，无需将它们放置在夹具中或使用复杂的处理系统。

使用RotoVAC滚筒设计，只需填充滚筒并将其放入真空室中即可。旋转将确保所有零件都得到处理。

在处理室中，真空积聚高达0.1至4 mbar之间，然后通过集成的等离子电极产生放电。处理周期时间通常很短，在20-180秒之间，具体取决于材料及其配方。

RotoVAC等离子处理机因其操作简单，生产可靠性和快速工艺速度而受到赞赏。可以应用处理氩气和氧气等气体，但在大多数情况下，由于等离子体放电暴露的高功率，这不是必需的。RotoVAC使用先进的Tantec发电机HV-X系列作为电源，并专门设计的等离子变压器为等离子电极提供电压。

旋转滚筒确保所有部件得到同等对待。该概念包括一个额外的滚筒，可以在处理期间装载，并在批次完成后与正在使用的滚筒简单地交换。

Easy to install and use Connect to mains power and compressed air.

Fast treatment times High power impact enables treatment times from 20-180 seconds, depending on material.

Standard or customised chambers Chamber and drum size can be designed to most applications. Many available as standard.

Vacuum level The plasma discharge is active from 0,1-4 mbar depending on application.

Process gas Process gasses such as oxygen and argon can be used, but in mostcases it is not necessary.

Process control The entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed through the touch panel. (Standard – Proface).

Cost efficient surface treatment Due to the low power and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion.

Vacuum pressure plasma Enables treatment of both conductive and non-conductive surfaces.

Technical Specifications RotoVAC Vacuum Plasma Treater

Mains voltage and frequency 230 VAC or 480 VAC 3Ph.

Output voltage/plasma power Max. 3,5kV/max. 2000 Watt

Power supply HV-X plasma generator series

Compressed air inlet 5–6 bar dry and clean

Process gas Standard: air, oxygen, argon, nitrogen on request

Vacuum pump capacity in m³/min. 15 to 240 m³/min., depending on size of vacuum chamber

Vacuum level 0,1–4 mbar

Evacuation time, typical 15-60 seconds, depending on chamber size and pump capacity

Plasma treatment time, typical 20–180 seconds, depending on material